Umahluko phakathi kwe-SMD kunye ne-COB encapsulation

Zombini izibane ezikhokeleyo ze-SMD kunye ne-COB ekhokelela ekukhanyeni ziyafumaneka kwiLediant. Ngaba uyawazi umahluko phakathi kwazo? Makhe ndikuxelele.

Yintoni i-SMD? Kuthetha izixhobo ezifakwe phezulu. Ifektri yokupakisha ye-LED usebenzisa inkqubo ye-SMD ilungisa i-chip engenanto kwi-bracket, idibanisa ngombane ezimbini ngeengcingo zegolide, kwaye ekugqibeleni ikhusela nge-epoxy resin.SMD isebenzisa iteknoloji ye-surface mount (SMT), enezinga eliphezulu lokuzenzekelayo kwaye ineenzuzo zobukhulu obuncinci, i-angle enkulu yokusasazeka, ukufana okuhle okukhanyayo, kunye nokuthembeka okuphezulu.

Yintoni i-COB? Kuthetha itshiphu ebhodini. Ngokungafaniyo ne-SMD, ethengisa amaso esibane kwi-PCB, inkqubo ye-COB kuqala igquma indawo yokubeka ye-silicon chip nge-thermal conductive epoxy resin (i-silver-doped epoxy resin) kumphezulu we-substrate. Emva koko i-chip ye-LED inamathele kwi-interconnection substrate kunye neglue conductive okanye non-conductive ngokusebenzisa i-adhesive okanye i-solder, kwaye ekugqibeleni ukudibanisa kombane phakathi kwe-chip kunye ne-PCB kufezekiswa ngocingo (intambo yegolide) yokudibanisa.


Ixesha lokuposa: Jul-19-2022